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Delay analysis and design exploration for 3D SRAM

机译:3D SRAM的延迟分析和设计探索

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The emerging three-dimension (3D) integration technology provides a solution to reduce delay in SRAM. In this paper, we present a physical based delay analysis approach to explore 3D SRAM design options. Our analysis can be used to optimize the 3D SRAM timing performance at both sub-array and system level. Design examples based on the MITLL 3D process are constructed to demonstrate the trade-offs. As the analysis results show, the optimized 3D sub-array provides up to 20% extra improvement for SRAM access time reduction.
机译:新兴的三维(3D)集成技术提供了减少SRAM延迟的解决方案。在本文中,我们提出了一种基于物理的延迟分析方法,以探索3D SRAM设计选项。我们的分析可用于优化子阵列和系统级别的3D SRAM时序性能。构造了基于MITLL 3D流程的设计示例,以说明这些取舍。分析结果表明,优化的3D子阵列可将SRAM访问时间减少多达20%。

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