Ampleon Netherlands B.V., Nijmegen, the Netherlands;
Ampleon Netherlands B.V., Nijmegen, the Netherlands;
Ampleon Netherlands B.V., Nijmegen, the Netherlands;
Ampleon Netherlands B.V., Nijmegen, the Netherlands;
Ampleon Netherlands B.V., Nijmegen, the Netherlands;
Ampleon Netherlands B.V., Nijmegen, the Netherlands;
Integration Engineering Department, Vanguard International Semiconductor Corporation, Hsinchu, Taiwan, R.O.C.;
Integration Engineering Department, Vanguard International Semiconductor Corporation, Hsinchu, Taiwan, R.O.C.;
Integration Engineering Department, Vanguard International Semiconductor Corporation, Hsinchu, Taiwan, R.O.C.;
Integration Engineering Department, Vanguard International Semiconductor Corporation, Hsinchu, Taiwan, R.O.C.;
Logic gates; Ions; Stress; Negative bias temperature instability; Thermal variables control; Metals; Radio frequency;
机译:反向偏置半导体功率器件发生温度和时间不稳定的条件
机译:正偏置温度不稳定性中的负阈值电压漂移和掺钇的HfO_2栅介质的负偏置温度不稳定性的正阈值电压漂移的研究
机译:偏置,电源电压和温度对FDSOI技术中电阻短路缺陷检测的影响
机译:在LDSMOSE技术中的偏置温度稳定性研究
机译:Columbia Linear Machine中混合平板-环形电子温度梯度模式不稳定性的研究
机译:生态研究中的临时仪器方法产生高度偏差的温度测量
机译:采用反向体偏置(RBB)的高达400°C高温的pD-sOI CmOs技术的模拟电路设计
机译:高温涡轮技术计划:第二阶段。技术测试和支持研究。汽轮机叶片技术用液体燃料高温燃烧器的设计与开发