Invisible Defect Identification by Electrical Nanoprobing Analysis

摘要

As the semiconductor technology keeps scaling down, failure analysis faces more complicated challenges in failure root cause identification. Conventional failure analysis may not effective in solving issue which implantation related. In some cases, electrical analysis and evidence can serve as an alternate and easier way for defect identification and subsequent root cause understanding. In this paper, an implantation related case was analyzed by electrical nanoprobing analysis. Defective location and subsequent implantation step was successfully isolated through detail electrical analysis and accurate data interpretation.