Semiconductor manufacturing process optimisation

摘要

In a semiconductor manufacturing process the number of process steps as well as the time taken by each step are vital in determining the yield and volume of the manufactured device. Additionally, the manufacturing recipe used at each process greatly determines the reliability and performance of the finished design. By tweaking the process recipe as well as the process times an optimized manufacturing process can be obtained. This work presents process optimization at both the electroplating, cmp and plasma ashing steps for various semiconductor devices with improved performance for all devices.