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Optimisation approaches for batch scheduling in semiconductor manufacturing

机译:半导体制造中批量计划的优化方法

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摘要

In this research, several approaches for the optimisation of batch processes are investigated and compared. The motivation for this is the analysis of an oven work centre in a semiconductor wafer fab. Different objectives like keeping operational due dates as well as the minimisation of lot completion time will be optimised with regard to existing process constraints. First, the problem is modelled from two different viewpoints: as scheduling problem and with the help of a simulation system. For this, it used mixed integer programming (MOP) and a discrete event simulation system respectively. As a next step, a MIP time window decomposition approach combining simulation and mathematical programming is discussed. This reduces the complexity of the given problem by solving local sub-problems. Experiments on real manufacturing data determine the optimisation potential for the work centre using the different approaches. This allows, among others, a comparison to dispatching strategies as they are used in the manufacturing line.
机译:在这项研究中,研究和比较了批处理过程优化的几种方法。这样做的动机是分析半导体晶圆厂中的烤箱工作中心。相对于现有的工艺约束条件,将优化不同的目标,例如保持工作截止日期以及最小化批量完成时间。首先,从两个不同的角度对问题进行建模:作为调度问题并借助仿真系统。为此,它分别使用混合整数编程(MOP)和离散事件模拟系统。下一步,将讨论结合了模拟和数学编程的MIP时间窗分解方法。通过解决局部子问题,这降低了给定问题的复杂性。实际制造数据的实验使用不同的方法确定了工作中心的优化潜力。除其他外,这可以与生产线中使用的调度策略进行比较。

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