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An apodized 3-GHz thin film piezoelectric on substrate FBAR

机译:FBAR基片上的变迹3-GHz薄膜压电

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An apodization method is illustrated in this work to enable displacement and strain energy confinement at the central section of the composite thin Film Bulk Acoustic wave Resonator (c-FBAR) while in operation at the resonance mode. The device is excited at a higher order thickness extensional mode. The proposed resonator is designed in sinc shape to attain high degree of energy localization. Here, the thin film piezoelectric on substrate (TPoS) configuration implemented by the Aluminum Nitride (AlN) MEMS-CMOS InvenSense Inc. platform is used to realize the resonators. The c-FBAR performance parameters are extracted through de-embedding the CMOS+MEMS measured data. An equivalent electrical modeling for c-FBAR operating in the Super High Frequency (SHF) is demonstrated. We successfully report a sinc c-FBAR resonator operating at 3.264 GHz with an electromechanical coupling coefficient >2.12%, an unloaded Q >2,500, and Figure of Merit of 53.
机译:在这项工作中,采用了一种变迹方法,以便在共振模式下工作时,能够将位移和应变能限制在复合薄膜体声波谐振器(c-FBAR)的中心部分。器件在更高阶的厚度扩展模式下被激发。提出的谐振器设计为正弦形状,以实现高度的能量定位。这里,由氮化铝(AlN)MEMS-CMOS InvenSense Inc.平台实现的薄膜压电衬底(TPoS)配置用于实现谐振器。通过去嵌入CMOS + MEMS测量数据来提取c-FBAR性能参数。演示了在超高频(SHF)下运行的c-FBAR的等效电气模型。我们成功地报告了一个在3.264 GHz下运行的sinc c-FBAR谐振器,其机电耦合系数> 2.12%,空载Q> 2,500,品质因数为53。

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