Physical-aware diagnosis of multiple interconnect defects

摘要

This paper presents a physical-aware diagnosis technique for failing dies with multiple interconnect defects, including open and bridging. Our diagnosis technique considers fault masking/reinforcement and Byzantine effects. We use a section, a piece of interconnect, as the physical-aware diagnosis unit. We adopt the Single Location in a Cluster (SLIC) technique, where sections with similar simulation failure are grouped into a cluster. Simulations on benchmark circuits demonstrated that our accuracy is much higher than that of a commercial tool, with very close diagnosis resolution, when 10 defects are injected.