EMI shielding performance by metal plating on mold compound

摘要

Conformal plating on mold compound is a new fabrication process technology, it offers new possibility for IC package design to improve features such as rigidization of the flexible core, heat sinking, 3D circuit patterning and EMI shielding. This fabrication technology had successfully demostrated a process which is able to achieve high reliable performance, as being proven to have high peeling strength and electrical consistency after sample had gone through the critical moisture and temperature cycle test. Following after the reliability test, this paper studies the shielding effectiveness of varying coating thickness with respect to laboratory simulated EMI condition using radio frequency from 10MHz to 5.8 GHz. Different metal namely pure nickel, nickel-phosphorous and pure plated copper are also being studies for their performance in the effectively of EMI sheilding.