首页> 外国专利> HIGH PERFORMANCE EMI/FRI SHIELDING POLYMER COMPOSITE HAVING EXCELLENT ELECTROMAGNETIC SHIELDING EFFECT BY SIMULTANEOUSLY INCLUDING A CONDUCTIVE FILTER AND METAL HAVING A LOW MELTING POINT

HIGH PERFORMANCE EMI/FRI SHIELDING POLYMER COMPOSITE HAVING EXCELLENT ELECTROMAGNETIC SHIELDING EFFECT BY SIMULTANEOUSLY INCLUDING A CONDUCTIVE FILTER AND METAL HAVING A LOW MELTING POINT

机译:同时包含导电过滤器和低熔点金属的高性能EMI / FRI屏蔽聚合物复合材料具有出色的电磁屏蔽效果

摘要

PURPOSE: A high performance EMI(electromagnetic interference)/RFI(radio frequency interference) shielding polymer composite is provided to minimize a surface impedance by maximizing network between conductive filters using a metal having a low melting point and to effectively perform EMI/RFI shielding by maximizing inner scattering of electromagnetic wave through the conductive filler.;CONSTITUTION: A high performance EMI/RFI shielding polymer includes a thermosetting polymer resin, a conductive filer which is a polyhedron, and a metal having a low melting point. The content of the metal having the low melting point is 1-10 volume %. The content of the conductive filer is 5-69 volume %. The polymer composite includes a glass fiber filler with an amount of 50 parts by weight or less based on 100.0 parts by weight of the polymer composite.;COPYRIGHT KIPO 2010
机译:目的:提供一种高性能的EMI(电磁干扰)/ RFI(射频干扰)屏蔽聚合物复合材料,以通过使用低熔点金属最大化导电滤波器之间的网络,从而最大程度地降低表面阻抗,并通过以下方式有效地进行EMI / RFI屏蔽组成:一种高性能EMI / RFI屏蔽聚合物,包括一种热固性聚合物树脂,一种多面体导电性填料和一种低熔点金属。低熔点金属的含量为1〜10体积%。导电填料的含量为5-69体积%。聚合物复合材料包括玻璃纤维填料,基于100.0重量份的聚合物复合材料,其含量为50重量份或更少。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100066881A

    专利类型

  • 公开/公告日2010-06-18

    原文格式PDF

  • 申请/专利权人 CHEIL INDUSTRIES INC.;

    申请/专利号KR20080125378

  • 发明设计人 KIM SUNG JUN;HONG CHANG MIN;

    申请日2008-12-10

  • 分类号C08K7/00;C08K3/08;C08L101/12;

  • 国家 KR

  • 入库时间 2022-08-21 18:32:28

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