METHOD FOR FORMING METAL PATTERN BY FORMING PHOTOCATALYST COMPOUND THIN FILM THROUGH COATING PROCESS AND FORMING METAL PATTERN THROUGH PLATING PROCESS, AND EMI FILTER USING THE SAME

摘要

PURPOSE: A method and an EMI filter are provided to obtain a metal wiring pattern of high conductivity in a rapid and efficient manner without a sputtering process, photo patterning process using a photosensitive resin, and an etching process. CONSTITUTION: A method comprises a first step of forming a photocatalyst film by coating a substrate with a photocatalyst compound; a second step of obtaining a potential pattern of nuclei for crystal growth by selectively exposing the photocatalyst film; and a third step of obtaining a metal pattern by plating the potential pattern of nuclei for crystal growth and growing a metal crystal.