WELCOME MESSAGE

摘要

This is the first time that the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) and the International Conference on Nanochannels, Microchannels and Minichannels (ICNMM) will jointly hold their conferences together. InterPACK is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). The InterPACK Conference Series was founded in 1992, by Professor Avi Bar Cohen, as the ASME-JSME Joint Electronic Packaging Conference. It was renamed InterPACK in 1995, and has been occurring biannually since then. We are grateful for the continued co-sponsorship of The Japan Society of Mechanical Engineers (JSME) from the beginning of the InterPACK series.