Design of multilevel interconnect network of an ASIC macrocell for 7.5nm technology node using carbon based interconnects

摘要

Multilevel interconnect network of a macrocell for 7.5 nm technology node is designed with carbon based interconnects (CBI) and Cu. Results are compared. Constrains of using CBI is discussed. It is shown that by using CBI power dissipation associated with wires could decrease by 32%. To use GNRs for more than one metal pair, reverse wire pitch idea is proposed that prevents undesirable increase in the number of metal layers.