System integration — The bridge between More than Moore and More Moore

摘要

System Integration using 3D technology is a very promising way to cope with current and future requirements for electronic systems. Since the pure shrinking of devices (known as “More Moore”) will come to an end due to physical and economic restrictions, the integration of systems (e.g. by stacking dies, or by adding sensor functions) shows a way to maintain the growth in complexity as well as in diversity which is necessary for future applications. This so called “More than Moore” approach complements the conventional SoC product engineering. This paper gives insights in System Integration design challenges from different perspectives, ranging from design technology over MEMS product engineering and 3D interconnect to automotive cyber physical systems.