Fraunhofer Inst. for Reliability Microintegration, Berlin, Germany;
copper alloys; etching; laser beam applications; printed circuits; sheet materials; vias; wafer level packaging; Cu; FOPLP; FOWLP; PCB technology; RCC; biomedical application; compression mold processes; copper line etching; copper plating; cost reduction; die pads; die placement; fan-out panel level packing approach; fan-out wafer level packaging; handheld consumer application; low cost PCB based RDL processes; maskless LDI technology real die positions; maskless laser direct imaging technology; maskless patterning; mic;
机译:芯片 - 最后(RDL-First)扇出面板级包装(foplp)用于异构整合
机译:使用RDL-First技术面板扇出面板级包装的翘曲
机译:用于异构整合的扇出芯片 - 最后面板级包装的热循环试验和仿真
机译:扇出面板层面包装的挑战和机遇(foplp)
机译:晶圆级封装中以聚合物为芯的焊球和扇出技术的研究
机译:扇出晶圆和面板级包装作为异构集成的包装平台
机译:使用蚁群优化倒置传播神经网络设计扇出面板级SIC MOSFET电源模块