Robustness study of solder joints of different compositions by using Stochastic Finite Element Modeling

摘要

Fatigue lifetime of eutectic SnPb and lead free solder joints is usually evaluated by deterministic models. These models do not take into account the uncertainties of model parameters, the variability of design parameters and the variability of operating conditions in service. In order to assess more accurately the robustness of critical solder joints of an automotive mechatronic device, a stochastic finite element model of solder joints is developed and its results are analyzed.