Via-last/backside-via 3D integration using a visible-light laser debonding technique

机译：使用可见光激光剥离技术的Via-last /背面通孔3D集成

获取原文

获取原文并翻译 | 示例

页面导航

摘要
著录项
相似文献
相关主题

摘要

A visible-light laser debonding technique is introduced for via-last/backside-via 3D integration. Temporary bonding of 12-inch wafers with a temporary glue and the subsequent wafer thinning processes give small TTV within 1 µm by using an auto-TTV functions. Cu-TSV daisy chains with TSV diameters of 5 µm are formed in 50-µm-thick thinned Si wafers.

机译：引入了可见光激光剥离技术，以实现通孔/后通孔3D集成。通过使用自动TTV功能，使用临时胶临时粘合12英寸晶圆并进行随后的晶圆减薄工艺，可在1 µm内获得较小的TTV。 TSV直径为5 µm的Cu-TSV菊花链在厚度为50 µm的薄化Si晶片中形成。

著录项

来源
《2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration》|2014年|13-13|共1页
会议地点 Tokyo(JP)
作者
Fukushima T.; Mariappan M.; Bea J.-C.; Hashimoto H.; Sato Y.; Motoyoshi M.; Lee K.-W.; Koyanagi M.;
展开▼
作者单位

GINTI, New Industry Creation Hatchery Center (NICHe), Tohoku University, 6-6-01 Aza-Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan;

展开▼
会议组织
原文格式 PDF
正文语种 eng
中图分类
关键词

相似文献

外文文献
中文文献
专利

1. Additive Manufacturing of Tungsten Carbide Hardmetal Parts by Selective Laser Melting (SLM), Selective Laser Sintering (SLS) and Binder Jet 3D Printing (BJ3DP) Techniques [J] . Padmakumar M. Lasers in Manufacturing and Materials Processing . 2020,第3期

机译：通过选择性激光熔化（SLM），选择性激光烧结（SLS）和粘合剂喷射3D印刷（BJ3DP）技术通过选择性激光熔融（SLM）和粘合剂射流件的添加剂制造
2. Temporary Wafer Bonding and Debonding for 3D Integration Using an Electrochemically Active Polymer Adhesive [J] . Hithesh K. Gatty, Stephan Schroder, Frank Niklaus ECS Journal of Solid State Science and Technology . 2014,第5期

机译：使用电化学活性聚合物胶粘剂进行3D集成的临时晶圆键合和剥离
3. 3d Integration With Tsv: Temporary Bonding And Debonding [J] . Stefan Pargfrieder, Juergen Burggraf, Daniel Burgstaller, Solid state technology . 2009,第3期

机译：与Tsv的3d集成：临时粘合和脱胶
4. Via-last/backside-via 3D integration using a visible-light laser debonding technique [C] . Fukushima T., Mariappan M., Bea J.-C., IEEE International Workshop on Low Temperature Bonding for 3D Integration . 2014

机译：使用可见光激光剥离技术的通过最后/背面通过3D集成
5. Integrating 3D layered manufacturing with photonic sintering, precision machining and smart coating techniques for rapid casting applications. [D] . Bohra, Hemant. 2014

机译：将3D分层制造与光子烧结，精密加工和智能涂层技术相结合，可用于快速铸造应用。
6. Debonding Time and Dental Pulp Temperature With the Er Cr: YSGG Laser for Debonding Feldespathic and Lithium Disilicate Veneers [O] . Marzieh Alikhasi, Abbas Monzavi, Hooman Ebrahimi, 2019

机译：用ErCr：YSGG激光脱粘时间和牙科纸浆温度
7. Integrating CAD and 3D-Printing Techniques to Construct an In Vitro Laser Standard Treatment Platform for Evaluating the Effectiveness of Sterilization by Er:YAG Laser in Peri-Implant Intra-Bony Defects [O] . Shih-Hao Chang, Hsiang-I Mei, Chun-Li Lin 2020

机译：集成CAD和3D打印技术，构建体外激光标准处理平台，用于评估ER的灭菌的有效性：YAG激光在Peri-incomant内骨内缺损

Via-last/backside-via 3D integration using a visible-light laser debonding technique

摘要

著录项

相似文献

相关主题

期刊订阅