3d Integration With Tsv: Temporary Bonding And Debonding

摘要

New temporary adhesive has been evaluated for its use in a temporary wafer bonding process. The adhesive meets all the requirements for bonding strength, chemical resistance, thermal stability, etc. to apply TSV process applications. The technology, including temporary bonding and debonding, offers time and cost efficiency for further 3D packaging integration processes utilizing existing and established equipments and technologies. These results have been confirmed with the achievement of high-performance TSVs with an aspect ratio of 1:1 on 8" wafers. The results confirm that the debonding and cleaning processes do not scratch the wafer or break the ultra-thin bottom of the TSVs (only 9um). The electrical tests performed showed that via resistance values were the same for TSVs processed using a temporary bonding layer compared to permanent bonding. Work continues on thermal stability of the adhesive material to enable the realization of TSVs with higher aspect ratios, as well as applications using high topographies like bumps and/ or chips.