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Growth and study of gold microplates for electrodes application

机译:电极用金微孔板的生长与研究

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The gold nanoparticles have been extensively used as contrast agents. They have been successfully used as part of the treatment for some diseases, like by directing gold nanoparticles into the nuclei of cancer cells, they can only not hinder them from multiplying, but also kill them. In this paper, we report the synthesis of gold microplates[1]. We employ thermolysis and spin coating techniques to obtain hexagonal and triangular Au microplates of large sizes upto hundreds of microns. This involves thermolysis of a precursor, (AuCl4) phase transferred from aqueous medium and stabilized in toluene by tetraoctylammonium bromide which yields large hexagonal and triangular gold microplates. The Optical Microscope was used to visualise the size of Au microplates on different substrates like HOPG, Si wafer and cover slip. It was found that Au microplates size on HOPG substrate varies from 5 to 18.84 µm, on Si wafer it varies from 4.79 to 25 µm and on cover slip, the size varies from 5.49 to 17.97 µm. The gold microplates have interesting properties which find applications in molecular electronics, surface science and electrode applications.
机译:金纳米颗粒已被广泛用作造影剂。它们已成功用于某些疾病的治疗,例如将金纳米颗粒引导到癌细胞的细胞核中,它们不仅可以阻止它们增殖,而且可以杀死它们。在本文中,我们报道了金微孔板的合成 [1] 。我们采用热解和旋涂技术来获得六角形和三角形的Au微孔板,尺寸大至数百微米。这涉及前体的热分解,(AuCl4)-相从水性介质中转移并通过四辛基溴化铵在甲苯中稳定,从而生成大的六角形和三角形金微孔板。光学显微镜用于可视化在不同衬底(如HOPG,Si晶片和盖玻片)上的Au微孔板的尺寸。发现HOPG基板上的Au微孔板尺寸在5至18.84 µm之间变化,在硅晶片上,其尺寸在4.79至25 µm之间变化,在盖玻片上,尺寸在5.49至17.97 µm之间变化。金微孔板具有令人感兴趣的特性,可在分子电子学,表面科学和电极应用中找到应用。

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