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Growth and study of gold microplates for electrodes application

机译:电极应用金微孔板的生长和研究

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The gold nanoparticles have been extensively used as contrast agents. They have been successfully used as part of the treatment for some diseases, like by directing gold nanoparticles into the nuclei of cancer cells, they can only not hinder them from multiplying, but also kill them. In this paper, we report the synthesis of gold microplates[1]. We employ thermolysis and spin coating techniques to obtain hexagonal and triangular Au microplates of large sizes upto hundreds of microns. This involves thermolysis of a precursor, (AuCl4)− phase transferred from aqueous medium and stabilized in toluene by tetraoctylammonium bromide which yields large hexagonal and triangular gold microplates. The Optical Microscope was used to visualise the size of Au microplates on different substrates like HOPG, Si wafer and cover slip. It was found that Au microplates size on HOPG substrate varies from 5 to 18.84 µm, on Si wafer it varies from 4.79 to 25 µm and on cover slip, the size varies from 5.49 to 17.97 µm. The gold microplates have interesting properties which find applications in molecular electronics, surface science and electrode applications.
机译:金纳米颗粒已被广泛地用作造影剂。它们已成功用作某些疾病的治疗部分的一部分,就像通过将金纳米颗粒引入癌细胞的细胞核,它们只能阻碍它们乘以繁殖,而且也杀死它们。在本文中,我们报告了金微孔板的合成 [1] 。我们采用热解和旋转涂层技术,获得大尺寸的六边形和三角形Au微孔板,高达数百微米。这涉及前体的热解,(AuCl4)− 从含水培养基中转移并通过四烷基铵溶质在甲苯中稳定的,得到大的六边形和三角形金微孔板。光学显微镜用于在跳跃,Si晶片和盖板等不同基板上可视化Au微孔板的尺寸。结果发现,跳蚤衬底上的Au微孔板尺寸从5到18.84µ m,在si晶圆上变化,它从4.79到25µ m和盖上盖板,大小不同于5.49到17.97&#x00b5 ; m。金微孔板具有有趣的性质,可在分子电子,表面科学和电极应用中找到应用。

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