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Impact of stress induced by stressors on hot carrier reliability of strained nMOSFETs

机译:应力源引起的应力对应变nMOSFET的热载流子可靠性的影响

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摘要

In this study, the nMOSFETs with contact-etch-stop-layer (CESL) stressor and SiGe channel have been fabricated with a modified 90-nm technology. The performance of nMOSFETs and stress distribution in the channel region have been investigated. The hot carrier reliability of the SiGe-channeled nMOSFETs with various CESL nitride layers has also been extensively studied. In addition, the impact of stress induced by CESL stressor and SiGe-channel on hot-carrier reliability of the strained nMOSFETs has been analyzed through experimental measurements and stress simulation results.
机译:在这项研究中,采用改良的90纳米技术制造了具有接触蚀刻停止层(CESL)应力源和SiGe沟道的nMOSFET。已经研究了nMOSFET的性能和沟道区域中的应力分布。还对具有各种CESL氮化物层的SiGe沟道nMOSFET的热载流子可靠性进行了广泛的研究。此外,通过实验测量和应力模拟结果,分析了CESL应力源和SiGe沟道引起的应力对应变nMOSFET的热载流子可靠性的影响。

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