首页> 外文会议>2012 IEEE International Conference on Electron Devices and Solid State Circuit. >An Intra-cavity bottom emitting 1325 nm VCSEL using GaInAs / GaInP MQWs and AlGaInAs / InP DBRs for epitaxial fabrication
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An Intra-cavity bottom emitting 1325 nm VCSEL using GaInAs / GaInP MQWs and AlGaInAs / InP DBRs for epitaxial fabrication

机译:使用GaInAs / GaInP MQW和AlGaInAs / InP DBR的腔内底部发射1325 nm VCSEL,用于外延制造

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摘要

In this paper, a bottom emitting Ga0.586In0.414As / Ga0.252In0.748P MQW Intra-cavity Vertical Cavity Surface Emitting Laser (VCSEL) capable of emitting light output at 1325 nm has been designed. After a number of computations of the material gain and band gap energy it has been found that the ternary compound of Ga0.586In0.414As as the quantum well material and the lattice matched ternary compound material Ga0.252In0.748P as the barrier material are suitable for operating at 1325 nm. Ga0.252In0.748P has been used for the 2 SCH layers which is also lattice matched. Si doped Al0.6In0.4As has been used as the lattice matched p-cladding material and C doped Al0.5In0.5As has been used as the n-cladding material. The design has been based on building the laser on an InP substrate which is lattice matched with the bottom DBR layers made of lattice matched Al0.26Ga0.21In0.53As / InP (48 pairs). The top DBR structure has been designed using Al0.26Ga0.21In0.53As / InP (80 pairs) which is also lattice matched with the p-cladding material and the active region material. This design is aimed at fabricating the VCSEL using the widely used epitaxial technologies. The performance characteristics of the designed VCSEL show expected performance.
机译:在本文中,底部发射Ga 0.586 In 0.414 As / Ga 0.252 In 0.748 P MQW腔内已经设计了能够发射1325 nm的光输出的垂直腔表面发射激光器(VCSEL)。经过大量的材料增益和带隙能量计算,发现Ga 0.586 In 0.414 As三元化合物作为量子阱材料,晶格匹配。作为阻挡材料的三元化合物材料Ga 0.252 In 0.748 P适合在1325 nm下工作。 Ga 0.252 In 0.748 P已用于两个晶格匹配的SCH层。硅掺杂的Al 0.6 In 0.4 As已被用作晶格匹配的p覆盖材料,而C掺杂的Al 0.5 In 0.5 < / inf> As已被用作n包层材料。该设计基于在InP衬底上构建激光器,该衬底与由晶格匹配的Al 0.26 Ga 0.21 In 0.53 < / inf> As / InP(48对)。顶部DBR结构是使用Al 0.26 Ga 0.21 In 0.53 As / InP(80对)设计的,也与p晶格匹配覆层材料和有源区材料。该设计旨在使用广泛使用的外延技术制造VCSEL。设计的VCSEL的性能特征显示了预期的性能。

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