Technology breakthrough of die backside film application in assembly process for small form factor package

摘要

A new material technology — die backside film is initiated to provide a solution for marking at die backside in small form factor package and yet serves as ultra thin silicon backside surface protection during assembly process. This paper describes the application and success criteria of the adhesive film that newly introduced in assembly. It presents the overall adhesive film assembly process flow on how it integrated into ultra thin die small form factor packaging process, adhesive film's cross module interaction and material characteristics.