FORMING METAL FILLED DIE BACKSIDE FILM FOR ELECTROMAGNETIC INTERFERENCE SHIELDING WITH CORELESS PACKAGES

摘要

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a cavity in a carrier material attaching a die in the cavity wherein a backside of the die comprises a metal filled DBF forming a dielectric material adjacent the die and on a bottom side of the carrier material forming a coreless substrate by building up layers on the dielectric material and removing the carrier material from the coreless substrate.