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Reliability of inversion channel InGaAs n-MOSFETs

机译:反向沟道InGaAs n-MOSFET的可靠性

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摘要

Reliability of InGaAs inversion channel n-MOSFET is investigated by systematic PBTI (positive bias temperature instability) stresses. The very complicated degradation phenomena are totally different from Si based MOSFETs. The degradation is mainly contributed by the generation of border traps under stress with recoverable donor trap of energy density ΔDSOXDONOR in the InGaAs energy gap with a tail extending to the conduction band energy, and with permanent acceptor trap of energy density ΔDSOXACCEPTOR in the conduction band energy with a tail extending to the energy gap. The border trap model can explain all the experimental details of the PBTI degradation phenomena.
机译:通过系统性的PBTI(正偏压温度不稳定性)应力研究了InGaAs反向沟道n-MOSFET的可靠性。非常复杂的退化现象与基于Si的MOSFET完全不同。降解主要是由于在应力下边界陷阱的产生以及在InGaAs能隙中具有可回收的能量密度为ΔD SOX DONOR 的供体陷阱,尾部延伸到导带能量,并在导带能量中具有永久性的能量密度ΔD SOX ACCEPTOR 的受体陷阱,尾部延伸至能隙。边界陷阱模型可以解释PBTI降解现象的所有实验细节。

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