The applications of wafer vacuum laminator equipment in 3D-IC process technology

机译：晶圆真空覆膜机设备在3D-IC工艺技术中的应用

获取原文

获取原文并翻译 | 示例

页面导航

摘要
著录项
引文网络
相似文献
相关主题

摘要

The technology of dry film laminator equipment has been developed in CSUN for more than a decade and widely adopted in PCB and Display industries.

机译：干膜层压机设备技术已在CSUN开发了十多年，并已广泛应用于PCB和显示行业。

著录项

来源
《2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference.》|2012年|p.315-319|共5页
会议地点 Taipei(CT);Taipei(CT)
作者
Sheng-Yu Lin; Ming-Tzung Chen; Jeng-Ping Yang; Pei-Wei Wang;
展开▼
作者单位

CSUN MFG. LTD., 3F, No.7-2, Industrial E Rd., IX, Science-Based Industrial Park, Hsinchu, Taiwan 300;

展开▼
会议组织
原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;微电子学、集成电路（IC）;
关键词

相似文献

外文文献
中文文献
专利

1. Single-wafer-processed trench-sidewall integration and its application in a micro resonant detector for vacuum monitoring [J] . Xinxin Li, Wei Xu, Ying Chen, Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures . 2006,第1期

机译：单晶片处理的沟槽-侧壁集成及其在用于真空监测的微谐振检测器中的应用
2. Application considerations for perfluoroelastomer seals used on wafer processing equipment [J] . John M. Legare, Shuhong Wang, Bunichi Rai Semiconductor International . 2006,第8期

机译：晶圆加工设备上使用的全氟弹性体密封件的应用注意事项
3. Application considerations for perfluoroelastomer seals used on wafer processing equipment [J] . John M. Legare, Shuhong Wang, Bunichi Rai Semiconductor International . 2006,第10期

机译：晶圆加工设备上使用的全氟弹性体密封件的应用注意事项
4. The applications of wafer vacuum laminator equipment in 3D-IC process technology [C] . Sheng-Yu Lin, Ming-Tzung Chen, Jeng-Ping Yang, International Microsystems, Packaging, Assembly and Circuits Technology Conference . 2012

机译：晶圆真空层压机设备在3D-IC工艺技术中的应用
5. Modeling the vacuum assisted resin transfer molding (VARTM) process for fabrication of fiber/metal hybrid laminates. [D] . Tuncol, Goker. 2010

机译：为制造纤维/金属混合层压板的真空辅助树脂传递模塑（VARTM）工艺建模。
6. Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests [O] . Chang-Chun Lee 2017

机译：晶圆级底部填充对热循环测试过程中超薄芯片堆叠式3D-IC组件微凸点可靠性的影响
7. Bubble Image Processing Algorithm and Application in Vacuum Casting Equipment [O] . 2016

机译：气泡图像处理算法及其在真空铸造设备中的应用
8. NEW APPLICATIONS FOR ARPANET DEVELOPED INFORMATION PROCESSING TECHNOLOGY, VOLUME Ⅲ BRIAREUSCOMPUTER NETTING FOR DESIGN, FABRICATION AND REPAIR OF ELECTRONIC EQUIPMENT [R] . PAUL BARAN 1975

机译：aRpaNET开发信息处理技术的新应用，第三卷BRIaREUsCOmpUTER网络设计，制造和修复电子设备

The applications of wafer vacuum laminator equipment in 3D-IC process technology

摘要

著录项

引文网络

相似文献

相关主题

期刊订阅