Process for preparation of Al filled contact holes in a wafer using a vacuum coating useful in semiconductor technology giving quick and cost effective preparation of Al-filled contact holes in a semiconductor wafer

摘要

Preparation of Al filled contact holes in a wafer using a vacuum coating unit the chambers of which, via a transfer chamber, are coupled to a wafer transfer handler, where after structuring the contact holes by a CVD-process a thin Ti or Ti-Ti nitride layer is separated, the wafer (1) is cooled to ambient temperature, a cold Al-PVD coating is applied in a PVD-Al-ESC-chamber, and the wafer is heated in this chamber, giving a separated hot Al-PVD coating.