首页> 外文会议>2012 17th Opto-Electronics and Communications Conference : Technical Digest >Small-feature-size Etching of InP/InGaAsP by inductively coupled plasma at ultra-low pressure
【24h】

Small-feature-size Etching of InP/InGaAsP by inductively coupled plasma at ultra-low pressure

机译:超低压感应耦合等离子体对InP / InGaAsP的小尺寸蚀刻

获取原文
获取原文并翻译 | 示例

摘要

Deep etching for InP/InGaAsP based slotted photonic crystal by inductively coupled plasma at ultra-low pressure was studied. High-aspect-ratio of 28 for 60-nm-wide slots and 17 for air-holes with diameter of 200 nm was achieved, respectively.
机译:研究了超低压感应耦合等离子体对InP / InGaAsP基缝隙光子晶体的深腐蚀。对于60 nm宽的缝隙,高纵横比分别为28;对于直径为200 nm的气孔,高纵横比为17。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号