A system level modeling for distributed RF MEMS devices considering thermally induced packaging effect

摘要

This paper presents a modeling of the mechanical-thermo-electromagnetic coupling behavior of packaged distributed radio frequency microelectromechanical systems (RF MEMS). The whole structure is divided into fundamental elements. These elements are connected via both lumped nodes and distributed nodes. The thermo-mechanical and/or the electromagnetic models for each element are analytically established and integrated together using the continuity conditions at the nodes. MATLAB is used as a calculation platform. Finite element method (FEM) simulations and experiments are conducted to validate the models. The results from the three approaches show good agreement. It is shown that thermally induced packaging effect has considerable impact on the phase shift performance of this kind of complex RF MEMS device.