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A BIST scheme for high-speed Gain Cell eDRAM

机译:高速增益单元eDRAM的BIST方案

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A built-in self-test (BIST) scheme is presented for at-speed test of the novel Gain Cell-based embedded DRAM which can operate at the high frequency of 200MHz. This BIST implementation consists of instruction set architecture (ISA) and hardware. A 4-stage pipeline for instruction execution makes at-speed test possible. Various kinds of tests, including single-address test, traversal test and refresh test, can be performed by executing different instruction combinations. An 8KB Gain Cell memory with the BIST is fabricated in 0.13µm CMOS technology. Silicon measurement on ATE shows that the BIST can perform at-speed test and measurement types mentioned above.
机译:提出了一种内置自测(BIST)方案,用于对基于Gain Cell的新型嵌入式DRAM进行全速测试,该DRAM可在200MHz的高频下工作。此BIST实现由指令集体系结构(ISA)和硬件组成。用于指令执行的4级流水线使全速测试成为可能。通过执行不同的指令组合,可以执行各种测试,包括单地址测试,遍历测试和刷新测试。具有BIST的8KB增益单元存储器采用0.13µm CMOS技术制造。 ATE上的硅测量表明BIST可以执行上述的全速测试和测量类型。

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