首页> 外文会议>2010 11th International Conference on Thermal, Mechanical amp; Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) >Evaluation of probing process parameters and PAD designs: Experiments and modelling correlations for solving mechanical issues
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Evaluation of probing process parameters and PAD designs: Experiments and modelling correlations for solving mechanical issues

机译:评估探测过程参数和PAD设计:解决机械问题的实验和建模相关性

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摘要

Electrical Wafer Sort is known to induce stress in the pad structure and can lead to mechanical failures. In the present work, both EWS process (over drive and number of passes) and die pad design (thicknesses and interconnect layer architectures) parameters are evaluated through actual tests and Finite Element Modelling.
机译:众所周知,电晶圆分类会在焊盘结构中产生应力,并可能导致机械故障。在当前工作中,通过实际测试和有限元建模来评估EWS过程(驱动和通过次数)和管芯焊盘设计(厚度和互连层体系结构)参数。

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