Heat spreader with aligned CNTs designed for thermal management of HB-LED packaging and microelectronic packaging

摘要

A novel heat spreader with aligned CNT arrays synthesized on both sides is demonstrated to provide a low cost, effective thermal management method for high-brightness light emitter diode (HB-LED) packaging and microelectronic packaging. With this heat spreader, Si device and heat sink can be directly bridged and no further TIM or individual heat spreader is needed. The thermal resistance of the novel heat spreader with CNTs on both sides was only about 30% of that of conventional heat spreader with silver epoxy TIM on both sides. The thermal performance of the novel heat spreader can be further improved by optimizing CNT synthesis parameters.