The Research status of Stress and Failure Analysis in Ceramic Packaging

摘要

Ceramic packages utilize a wide spectrum of materials ranging from traditional ceramics and metals-alloys to specialized metal-matrix composites, ceramic-filled polymers, and glass-cloth laminates. Pronounced stress, therefore, generated as a result of a mismatch in thermal expansion coefficients, might give rise to a ceramic device failure. Meanwhile, Ceramic is inherently brittle, this characteristic leads to a distinguishing failure mode, compared with the plastic packaging. Based upon numerous research results in recent years, this paper reviews the development in ceramic packages, the failure analysis in ceramic components, the variation of ceramic properties during assembly processing and service conditions, the stress distribution and corresponding optimized design. Some problems and challenges have also been presented in this paper.