FINITE ELEMENT PARAMETRIC ANALYSIS ON FINE-PITCH BGA (FBGA) PACKAGES

摘要

Reduction in size of portable products such as cellular phones and camcorders has led to the miniaturization of integrated circuit packages. Fine-pitch BGA (FBGA) packages has been gaining its popularity due to compact in size and relatively low costing. With further down-sizing in package height, reliability issues like die cracking and warpage have surfaced as potential failures. Die cracks results in malfunction of an IC package, while the latter causes difficulty in board surface mounting. In this study, effects of package height on the die stress and warpage have been assessed by FEA. With overmold height ranging from 0.4～0.6mm and substrate from 0.16～0.32mm thick, the Overall Package Thickness coding from "T" (1.00