Barriers and Opportunity for Power Train Integrated Power Electronics

摘要

Automotive electronic modules in practice are packaged in the most environmentally benign location possible with only their attendant sensors and actuators left in harsh environments. In recent years there have been periodic attempts to move the electronic control modules in closer proximity to the vehicle and power train functions they serve to minimize harness, connector and installation costs. Mounting control modules directly to the engine or transmission is made difficult by not only the higher local temperatures but by extremes in vibration. Simultaneous temperature and vibration play a crucial role in the selection of module package technology, methods of interconnection and functionality in general. This paper looks at an emerging trend to migrate functionality into higher level modules such as the vehicle controller. Combined with the now widely proliferated consumer electronic connections there may be further opportunity to provide enhanced module reliability by a more synergistic view of available computing power on the automobile and its external environment.