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Failure Models and Comparison on Short-circuit Performances for SiC JFET and SiC MOSFET

机译:SiC JFET和SiC MOSFET的故障模型及短路性能比较

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Based on the traditional circuit models of SiC JFET and SiC MOSFET, failure models in short-circuit case for the two SiC devices have been presented. The failure models have considered the leakage currents inside the devices when the short-circuit occurs. For both of SiC JFET and SiC MOSFET, the leakage current between the drain and the source has been introduced. In addition, for SiC MOSFET, the gate leakage current has been included. Furthermore, the mobility dependent on the temperature and the electric-field strength is used to accurately describe the carrier behaviour in the channel of the two SiC transistors. The failure models of the two SiC transistors had been verified by the results from TCAD simulations and other's experimental results. With our failure models, the comparison of short-circuit performances between SiC JFET and SiC MOSFET have been conducted.
机译:基于SiC JFET和SiC MOSFET的传统电路模型,提出了两种SiC器件在短路情况下的故障模型。故障模型考虑了发生短路时设备内部的泄漏电流。对于SiC JFET和SiC MOSFET,都引入了漏极和源极之间的泄漏电流。另外,对于SiC MOSFET,栅极泄漏电流已包括在内。此外,取决于温度和电场强度的迁移率用于精确描述两个SiC晶体管的沟道中的载流子行为。通过TCAD仿真和其他实验结果验证了这两个SiC晶体管的故障模型。利用我们的故障模型,对SiC JFET和SiC MOSFET的短路性能进行了比较。

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