A Unified Multilayered Framework of Integrated Multifrequency Multichip Modules for Low-Cost Millimeter Wave Circuits and Systems

摘要

The recently proposed hybrid integration technique of planar/NRD-guide circuits and the progress in the development of 3D MMICs suggest that a unified multilayered framework of integrated multifrequency multichip modules be attractive for low-cost icrowave and millimeter-wave circuits and systems. This new generalized scheme makes it possible to exploit complementary distinctive advantages of various strip/slot planar structures and NRD-guide. This paper reviews briefly the research progress on this new technique. Potential problems are discussed and future directions are indicated on this particular subject.