PRESSURE MOUNTING TECHNOLOGY FOR SMT DEVICES: AN ALIGNMENT AND ATTACHMENT SOLUTION

摘要

The ICE system is a non-destructive method of mounting SMT devices. It consists of a chuck assembly, held in place by a base plate, which aligns and fits the SMT device at an appropriate position. This placement is repeatable. It is well suited for testing SMT devices prior to attaching them to production PCB's. Preliminary test results show that electrical characteristics of SMT devices attached to a PCB by means of the ICE system are similar to those of SMT devices soldered to a PCB.