MANUFACTURING QUALIFICATION FOR THE LATEST GAMING DEVICE WITH Pb-FREE ASSEMBLY PROCESS

摘要

This paper will address a comprehensive qualification on a gaming device with Pb-free assembly process. Increased computational speed and graphically virtual reality of gaming device pushed the assembly design denser and thermally more challenging. In the assembly, both SMT and wave soldering processes are employed in the massive manufacturing processes of this Pb-free product. The process qualifications are verified by employing different techniques, 2D X-ray, C-SAM, micro-cross sectioning, SEM, solder joint shear, and dye & pry tests. Solder joint wetting quality, joint strength, sustainability of BGA joints to mechanical stress, resistant to Pb-free high temperature of MSL thermal sensitive components and inter-metallic layer formation in solder joint are evaluated. Results from the evaluation will be described in detail. Mechanical stress in each stage is also evaluated in each of the process flow from the front end to the back end in the manufacturing floor.