USING UNDERFILLS TO ENHANCE DROP TEST RELIABILITY OF Pb-FREE SOLDER JOINTS IN ADVANCED CHIP SCALE PACKAGES

摘要

In this paper we compare the reliability of two different sized area array components: 0.4mm pitch wafer level chip scale packages (WLCSP) and 0.5 mm pitch chip scale package (CSP). The reliability of these devices, in both Sn/Pb and lead-free assemblies are evaluated using industry standard drop test methodology. The improvement of the reliability of these devices thorough the use of underfill systems is also demonstrated.