APPARATUS AND METHOD FOR TESTING CHIP SCALED PACKAGE AND PCB, FOR ENHANCING TEST RELIABILITY

摘要

PURPOSE: An apparatus and a method for testing a chip scaled package are provided to enhance the test reliability by testing easily electrical characteristics between the chip scaled package and a pad part of a PCB(Printed Circuit Board). CONSTITUTION: A connection board includes an upper pad part(320), a lower pad part(340), a connection line(360) for connecting electrically the upper pad part to the lower pad part, and a probing part connected to a tester(600). A connection block includes a plurality of pogo pins(220), which are connected to pads of a pad part of an external board and pads of the power pad part of the connection board. A socket(400) includes a plurality of pogo pins which are connected to an external connection terminal and pads of the upper pad part of the connection board.