首页> 外文会议>Symposium on Chemical Aspects of Electronic Ceramics Processing November 30-December 4, 1997, Boston, Massachusetts, U.S.A. >Temperature-dependent studies of a-SiC:H growth by remote plasma CVD using methylsilanes
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Temperature-dependent studies of a-SiC:H growth by remote plasma CVD using methylsilanes

机译:使用甲基硅烷的远程等离子体CVD对a-SiC:H生长的温度依赖性研究

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Thin hydrogenated amorphous silicon carbide (a-SiC:H) films were grown at substrate temperatures rangine from 200 K to 600 K by remote ECR plasma-enhanced CVD. Mono-and trimethylsilane were used as single source precursors. The films grown using both precursors were compared as a function of temperature by in situ multiple internal reflection Fourier transform infrared (MIR-FTIR) spectroscopy. The difference in growth temperature leads to changes in both the hydrogen content and the composition of the film. At low growth temperature, films incorporate high concentrations of intact methyl group and a mixture of SiH_2(X chemical bounds 1-3) groups, with a polysilane-like structure. At higher temperatures, the hydrogen content decreases. This decrease is observed in two different ways: (1) a loss of highly hydrogenated SiH_x groups (SiH_3 or SiH_2); and (2) s ahift from methyl groups to CH_2 and CH bonding. However, the temperature dependence of each functional group is found to be different for the two precurosrs.
机译:通过远程ECR等离子体增强CVD,在200 K至600 K的衬底温度范围内生长氢化非晶硅碳化硅(a-SiC:H)薄膜。单和三甲基硅烷用作单源前体。通过原位多重内反射傅里叶变换红外(MIR-FTIR)光谱比较了使用这两种前体生长的薄膜作为温度的函数。生长温度的差异导致氢含量和膜组成的变化。在低的生长温度下,薄膜会掺入高浓度的完整甲基和具有类似聚硅烷结构的SiH_2(X化学键1-3)基团的混合物。在较高温度下,氢含量降低。这种减少以两种不同的方式观察到:(1)高度氢化的SiH_x基团(SiH_3或SiH_2)的损失; (2)从甲基到CH_2和CH键的键合。但是,发现两个前驱体对每个官能团的温度依赖性不同。

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