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Growth mechanism and chemical structure of amorphous hydrogenated silicon carbide (a-SiC:H) films formed by remote hydrogen microwave plasma CVD from a triethylsilane precursor: Part 1

机译:通过远程氢微波等离子体CVD由三乙基硅烷前体形成的非晶氢化碳化硅(a-SiC:H)膜的生长机理和化学结构:第1部分

摘要

Amorphous hydrogenated silicon carbide (a-SiC:H) films are produced by remote microwave hydrogen plasma (RHP)CVD using triethylsilane (TrES) as the single-source precursor. The reactivity of particular bonds of the precursor in the activation step is examined using tetraethylsilane as a model compound for the RHP-CVD experiments. The susceptibility of a TrES precursor towards film formation is characterized by determining the yield of RHP-CVD and comparing it with that of the trimethylsilane precursor. The effect of substrate temperature (Ts) on the rate of the RHP-CVD process, chemical composition, and chemical structure of the resulting a-SiC:H films is reported. The substrate temperature dependence of the film growth rate implies that film growth is independent of the temperature and RHP-CVD is a mass transport-limited process. The examination of the a-SiC:H films, performed by means of X-ray photoelectron spectroscopy (XPS), elastic recoil detection analysis (ERDA), and Fourier transform infrared absorption spectroscopy (FTIR), reveals that the increase in the substrate temperature from 30 °C to 400 °C causes the elimination of organic moieties from the film and the formation of a Si-carbidic network structure. On the basis of the results of the structural study, the chemistry involved in film formation is proposed. © 2009 WILEY-VCH Verlag GmbH & Co. KGaA.
机译:使用三乙基硅烷(TrES)作为单源前驱物,通过远程微波氢等离子体(RHP)CVD生产非晶态氢化碳化硅(a-SiC:H)膜。使用四乙基硅烷作为用于RHP-CVD实验的模型化合物,检查了活化步骤中前体特定键的反应性。 TrES前体对成膜的敏感性是通过确定RHP-CVD的产率并将其与三甲基硅烷前体的产率进行比较来表征的。报道了衬底温度(Ts)对RHP-CVD工艺的速率,所得a-SiC:H膜的化学组成和化学结构的影响。衬底温度对薄膜生长速率的依赖性意味着薄膜的生长与温度无关,RHP-CVD是一种限制传质的过程。通过X射线光电子能谱(XPS),弹性反冲检测分析(ERDA)和傅里叶变换红外吸收光谱(FTIR)对a-SiC:H薄膜进行的检查显示出衬底温度的升高如果温度从30°C到400°C,则会消除薄膜中的有机部分,并形成Si碳化网络结构。根据结构研究的结果,提出了参与膜形成的化学反应。 ©2009 WILEY-VCH Verlag GmbH&Co. KGaA。

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