A volume acoustic resonator package according to an embodiment of the present invention includes a package substrate, a cover bonded to the package substrate, an acoustic resonator accommodated in an accommodating space formed by the package substrate and the cover, and the acoustic resonator disposed in the accommodating space. A conductive wire electrically connecting the resonator to the package substrate, and a bonding portion for fixedly coupling the acoustic resonator to the package substrate, wherein the bonding portion may include an adhesive member including silicon.
展开▼
