Electronic component with media-tight encapsulation and method for producing an electronic component with media-tight encapsulation

摘要

The invention relates to an electronic component with medium-tight encapsulation, comprising a flexible substrate, in particular a textile, an electronic component and a medium-tight encapsulation layer, the component being arranged between the flexible substrate and the encapsulation layer and being completely enclosed by the substrate and the encapsulation layer, wherein the encapsulation layer has a foam-like structure at least in regions.