Opto Lithographic technologies for photomasks'production and components' forming for IC packing by Flip Chip method

摘要

The technologies of poto and laser lithography are widely used in IC production of different complexity,in semiconductor devices'production and also in production of hybrid circuits and precise circuit boards. The results of tests and also taking into account the demands of the production engineers of Bumping processallowed us to formulate the demands towards projectionoptics of new Bumping stepper EM-5534, which has noanalogues among photolithography equipment for thistechnology in the world.