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Comprehensive thermal mapping of an electronic circuit design through design simulation

机译:通过设计模拟实现电子电路设计的综合热映射

摘要

A simulation application can be executed by a computer system to develop thermal maps for an electronic architectural design. The simulation application can simulate the electronic architectural design over time. The simulation application can capture electronic signals from the electronic architectural design as the electronic architectural design is being simulated over time. The simulation application can determine power consumptions of the electronic architectural design over time from the electronic signals. The simulation application can derive temperatures of the electronic architectural design over time from the power consumptions. The simulation application can map the temperatures onto an electronic circuit design real estate of the electronic architectural design to develop the thermal maps over time.
机译:计算机系统可以执行模拟应用程序,为电子建筑设计绘制热图。模拟应用程序可以模拟电子架构设计随时间的变化。随着电子架构设计的模拟时间的推移,模拟应用程序可以从电子架构设计中捕获电子信号。模拟应用程序可以根据电子信号确定电子架构设计的功耗。模拟应用程序可以从功耗中得出电子架构设计随时间变化的温度。模拟应用程序可以将温度映射到电子电路设计-电子架构设计的房地产上,以开发随时间变化的热图。

著录项

  • 公开/公告号US11334700B1

    专利类型

  • 公开/公告日2022-05-17

    原文格式PDF

  • 申请/专利权人 SYNOPSYS INC.;

    申请/专利号US202016875238

  • 申请日2020-05-15

  • 分类号G06F17/10;G06F30/367;G06F119/06;G06F119/08;

  • 国家 US

  • 入库时间 2022-08-25 01:01:38

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