首页>
外国专利>
APPARATUS AND METHOD FOR SEMICONDUCTOR PACKAGE FAILURE ANALYSIS
APPARATUS AND METHOD FOR SEMICONDUCTOR PACKAGE FAILURE ANALYSIS
展开▼
机译:半导体封装失效分析装置和方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A pulsed laser apparatus for milling a sample is described. The apparatus includes a pulsed laser, a scan head for scanning a beam from the pulsed laser across the sample and an F-theta lens for focusing the scanned beam onto the sample. The apparatus may also include a liquid bath for milling the sample under the liquid, such as water. Methods of pulsed laser milling are also described.
展开▼