Method for analyzing a workpiece surface for a laser processing process and an analysis device for analyzing a workpiece surface

摘要

The invention relates to a method for analyzing a workpiece surface for a laser processing process comprising the steps: irradiating a line of light of a first wavelength range into a region of the workpiece surface and illuminating the region of the workpiece surface with light of a second wavelength range wavelength range; receiving an image of the region of the workpiece surface by means of a sensor device comprising an image sensor and an optics for imaging to the image sensor, wherein the optics has different refractive indices for the first and second wavelength range, and wherein a first plane,defined by the light line and a light exit point of the light, the optics and the image sensor are arranged in a sham flight arrangement, and evaluating the image for analyzing features of the workpiece surface, based on a predetermined offset between the first plane and a second plane, for which the light of the second wavelength range is sharply mapped by the optics to the sensor level of the image sensor. The invention also relates to an analysis device which is equipped for performing the method.