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Microelectronic assemblies comprising a package substrate portion integrated with a substrate integrated waveguide filter
Microelectronic assemblies comprising a package substrate portion integrated with a substrate integrated waveguide filter
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机译:微电子组件包括与基板集成波导滤波器集成的封装基板部分
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摘要
Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.
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