首页> 外国专利> MONOLITHIC LEAD ASSEMBLY AND METHODS OF MICROFABRICATING A MONOLITHIC LEAD ASSEMBLY

MONOLITHIC LEAD ASSEMBLY AND METHODS OF MICROFABRICATING A MONOLITHIC LEAD ASSEMBLY

机译:单片铅组件及微制造单片铅组件的方法

摘要

The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and a plurality of conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly may further include an electrode assembly formed on the supporting structure at the distal end of the cable. The electrode assembly includes one or more electrodes in electrical connection with one or more conductive traces of the plurality of conductive traces.
机译:本公开涉及一种单片薄膜引线组件和微伪缩小单片薄膜引线组件的方法。 特别地,本公开的方面涉及一种单片薄膜引线组件,其包括具有近端的电缆,远端,延伸从远端到远端的支撑结构,以及多个导电迹线 形成在支撑结构的一部分上。 支撑结构包括一个或多个介电材料层。 单片薄膜引线组件还可包括在电缆远端处的支撑结构上形成的电极组件。 电极组件包括与多个导电迹线的一个或多个导电迹线的电连接中的一个或多个电极。

著录项

  • 公开/公告号US2022037054A1

    专利类型

  • 公开/公告日2022-02-03

    原文格式PDF

  • 申请/专利权人 VERILY LIFE SCIENCES LLC;

    申请/专利号US201917277000

  • 发明设计人 ANNAPURNA KARICHERLA;BO LU;KEDAR SHAH;

    申请日2019-09-13

  • 分类号H01B7/08;H01B13;H05K3/46;

  • 国家 US

  • 入库时间 2022-08-24 23:36:13

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